Reliability and Failures of Electronic Components /Systems

Author:

BĂJENESCU Titu-Marius

Abstract

The typical bathtub curve and its “standard” shape have been widely accepted as an engineering tool in reliability management and training. The paper is not only focused on the performance at different periods but trying to reveal some in-depth considerations regarding service life and reliability, defect and failure, failure categories and classifications, failure mechanisms, factors favouring electronic systems failures, the process problems, or the passivation layer.

Publisher

Editura Electra

Subject

Electrical and Electronic Engineering,Control and Systems Engineering

Reference29 articles.

1. "[1] Bâzu M. şi T. Băjenescu (2011), Failure Analysis. A Practical Guide for Manufacturers of Electronic Components and Systems, J. Wiley & Sons.

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3. [3] De Wolf, I., (2006) Reliability issues in MEMS: Physics of failure and design for reliability, Patent DfMM & Memunity Workshop, 27 Nov. Milan, Italy.

4. [4] O’Connor, P. D. T.,(2000) Reliability past, present and future, IEEE Trans. on Reliability, Vol. 49, Issue 4.

5. [5] Greathouse, S. W., (2006) Application-specific reliability in new product applications, Future Fab Intl., Vol. 20, Intel Corporation, July.

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