1. (1) The Institute of Electrical Engineers of Japan, “The basics of latest laser processing and industrial application”, Ohmsha, 2007.
2. (2) H. Otsuki, T. Ito, H. Aoyama, S. Tohyama, and H. Hirai, 2006, “Development of Laser Drilling Machine for Printed Wiring Boards”, JSME Annual Meeting, 7: 331-332.
3. (3) N. Michigami, M. Yamaga, M. Kawamura, O. Kuze and S. Nakamura, “Manufacturing Device of Printed Circuit Board for High-density Multilayer Wiring”, Hitachi Hyoron, Vol.93, No.02:192-197
4. (4) Japan Jisso Technology Roadmap Council, “Japan Jisso Technology Roadmap 2011”, Japan Electronics and Information Technology Industrial association, 2011.
5. (5) ISO 281:2007, “Rolling bearing - Dynamic load ratings and rating life”.