Prediction of Thermal Deformation of Multi-Layered Substrate, and Its Application to Warpage Analysis of Package-Reference-Cited by-同舟云学术

Prediction of Thermal Deformation of Multi-Layered Substrate, and Its Application to Warpage Analysis of Package

Published:2010 Issue:762 Volume:76 Page:127-135
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

MATSUDA Kazutoshi¹,IKEDA Toru,MIYAZAKI Noriyuki

Affiliation:

1. SiP Design Department LSI Assy Engineering Division, Sony Semiconductor Kyushu Corporation Oita Technology Center

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.jstage.jst.go.jp/article/kikaia1979/76/762/76_KJ00006164547/_pdf

Reference9 articles.

1. 1) NAGATAKE M. Structural Analysis in Bending Distance of PWB. Mate 2005, 11th Symposium on Micro Joining and Assembly Technology in Electronics, February. (2005) p.333-338.

2. 2) ITOH N. Study on PWB Warpage Analysis. Mate2006, 12th Symposium on Micro Joining and Assembly Technology in Electronics, February. (2006) p.461-466.

3. 3) HUTAPEA P. Prediction of microelectronic substrate warpage using homogenized finite element models. Microelectric Engineering. (2006) vol.83, p.557-569.

4. 4) YOKOHORI T. Material Strength of Polymer. Ohmsha, Ltd.. (1982)

5. 5) HIRATA I. Study of LSI-Package Warp Deformation Using FEM Visco-elastic Simulation. Mate2005, 11th Symposium on Micro Joining and Assembly Technology in Electronics, February. (2005) p.329-332.

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2. Visco-Elastic Analysis for Warpage of Electronic Package Considering Change in Material Properties of Mold Resin Caused by Reflow Heating;Journal of Japan Institute of Electronics Packaging;2011