Development of Epoxy Resin Polishing Pads for Glass Polishing-Reference-Cited by-同舟云学术

Development of Epoxy Resin Polishing Pads for Glass Polishing

Published:2011 Issue:777 Volume:77 Page:2153-2161
ISSN:0387-5024
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C
language:en
Short-container-title:Trans.JSME(C)

Author:

MURATA Junji¹,TANI Yasuhiro¹,HIROKAWA Ryoichi,NOMURA Nobuyuki,ZHANG Yu¹,UNO Junki

Affiliation:

1. Ritsumeikan Univ., Dept. of Mechanical Engineering

Publisher

Japan Society of Mechanical Engineers

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials

Link

Reference7 articles.

1. (1) 村田順二,張宇,谷泰弘,"多孔質エポキシ樹脂研磨パッドの最適化に関する研究",2010年度砥粒加工学会学術講演会講演論文集,pp. 105-106.

2. (2) エポキシ樹脂技術協会編,総説エポキシ樹脂,第一巻 (2003),p.16,エポキシ樹脂技術協会.

3. (5) 土肥俊郎,黒河周平,大西修,山崎努,"超精密研磨/CMP技術とその最新動向(その2)-最新のCMP技術とトライボケミカル応用-"トロイボロジスト,vol. 55, No. 11 (2010), pp. 809-813.

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