Experimental and Numerical Verification of Fatigue Life Estimation for Solder Bumps-Reference-Cited by-同舟云学术

Experimental and Numerical Verification of Fatigue Life Estimation for Solder Bumps

Published:2001 Issue:4 Volume:44 Page:567-572
ISSN:1344-7912
Container-title:JSME International Journal Series A
language:en
Short-container-title:JSME Int. J., Ser. A

Author:

MUKAI Minoru¹,TAKAHASHI Hiroyuki¹,KAWAKAMI Takashi¹,TAKAHASHI Kuniaki²,IWASAKI Ken³,KISHIMOTO Kikuo⁴,SHIBUYA Toshikazu⁴

Affiliation:

1. Research and Development Center, Toshiba Corporation

2. Digital Media Network Company, Toshiba Corporation

3. Semiconductor Company, Toshiba Corporation

4. Department of Mechanical and Intelligent Systems Eng., Tokyo Institute of Technology

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,General Materials Science

Link

http://www.jstage.jst.go.jp/article/jsmea/44/4/44_4_567/_pdf

Reference10 articles.

1. (2) Kitano, M., Kumazawa, T. and Kawai, S., A New Evaluation Method for Thermal Fatigue of Solder Joint, Advances in Electronic Packaging, Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging, EEP-Vol. 1-1 (1992), pp. 301-308.

2. (3) Yu, Q., Shiratori, M. and Wang, S., Thermal Conduction and Thermal Stress Analyses of Surface-Mount Assembly with a Solder Joint Element, Proceedings of the ASMEWAM, AMD-Vol. 187 (1994), pp. 205-211.

3. (4) Mukai, M., Kawakami, T., Endo, T. and Takahashi, K., Elastic-Creep Behavior and Fatigue Life in an IC Package Solder Joint, Proceedings of JSME the 4th Computational Mechanics Conference, No. 910-79 (1991), pp. 223-224.

4. An 820 pin PGA for ultralarge-scale BiCMOS devices

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