Fundamental Studies on the Copper and Nickel Electroplating Methods of Stress Analysis : Effects of the Ground Plating on the Proper Stress
Author:
Publisher
Japan Society of Mechanical Engineers
Subject
General Engineering
Link
http://www.jstage.jst.go.jp/article/jsme1958/25/209/25_209_1653/_pdf
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. AN APPLICATION OF COMPUTER IMAGE-PROCESSING AND FILMY REPLICA TECHNIQUE TO THE COPPER ELECTROPLATING METHOD OF STRESS ANALYSIS;Experimental Techniques;1994-01
2. Fatigue gage utilizing slip-initiation phenomenon in electroplated copper foil;Experimental Mechanics;1993-03
3. A Basic Study on Fatigue Gauge Made of Electroplated Copper Foil : Effects of Understress;JSME international journal. Ser. 1, Solid mechanics, strength of materials;1991
4. Stress concentration factors of grooved shafts in torsion;The Journal of Strain Analysis for Engineering Design;1985-07-01
5. Basic Study on Foil Strain Gauges Made of Electrodeposited Copper or Nickel;Bulletin of JSME;1983
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