Fatigue Crack Growth Rate Characteristics of Laser Shock Peened Ti-6Al-4V

Author:

Ruschau John J.1,John Reji2,Thompson Steven R.3,Nicholas Theodore2

Affiliation:

1. University of Dayton Research Institute, 300 College Park, Dayton, OH 45469

2. AFRL/MLLN, WPAFB, OH

3. AFRL/MLSC, WPAFB, OH

Abstract

The fatigue crack growth rate (FCGR) characteristics of Laser Shock Peened (LSP) titanium 6Al-4V were examined and compared to those of unprocessed material. The FCGR resistance of LSP processed material tested at low stress ratios (R) is shown to be significantly greater than for unprocessed, baseline material. The increased damage tolerance can be attributed to the large residual compressive stresses generated by the LSP process. Differences in the growth rate behavior due to LSP can be accounted for by using the closure corrected effective stress intensity range, ΔKeff, which takes into account only the portion of loading above the crack opening load. The rationale of using ΔKeff is also demonstrated through fractographic investigations.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference18 articles.

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2. Bates, W. F. Jr., “Laser Shock Processing of Aluminum Alloys,” Conference Proceedings from the American Society for Metals Applications of Lasers in Materials Processing, Apr. 1979, pp. 317–330.

3. Ford, S. C, Fairand, B. P., Clauer, A. H., and Galliher, R. D., “Investigation of Laser Shock Processing—Executive Summary,” AFWAL-TR-80-3001, Volume I, August 1980.

4. Clauer, A. H., Walters, C. T., and Ford, S. C., “The Effects of Laser Shock Processing on the Fatigue Properties of 2024-T3 Aluminum,” 1983 ASM Conference on Applications of Lasers in Materials Processing, American Society of Metals Report #8301-002, Jan. 1983.

5. Clauer, A. H., and Holbrook, J. H., “Effects of Laser Induced Shock Waves of Metals,” Shock Waves and High-Strain-Rate Phenomena In Metals (1981), Marc A. Meyers and Lawrence E. Murr, eds., pp. 675–702.

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