Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials
Author:
Prasher Ravi S.1, Shipley Jim1, Prstic Suzana1, Koning Paul1, Wang Jin-lin1
Affiliation:
1. Ch5-157, Intel Corporation, 5000 W. Chandler Blvd., Chandler, AZ 85226-3699
Abstract
Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research has primarily dealt with the understanding of the thermal conductivity of these types of TIMs. For thermal design, reduction of the thermal resistance is the end goal. Thermal resistance is not only dependent on the thermal conductivity, but also on the bond line thickness (BLT) of these TIMs. It is not clear which material property(s) of these particle laden TIMs affects the BLT and eventually the thermal resistance. This paper introduces a rheology based semiempirical model for the prediction of the BLT of these TIMs. BLT depends on the yield stress of the particle laden polymer and the applied pressure. The BLT model combined with the thermal conductivity model can be used for modeling the thermal resistance of these TIMs for factors such as particle volume faction, particle shape, base polymer viscosity, etc. This paper shows that there exists an optimal filler volume fraction at which thermal resistance is minimum. Finally this paper develops design rules for the optimization of thermal resistance for particle laden TIMs.
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference27 articles.
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