Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink
Author:
Affiliation:
1. Advanced Thermal Engineering Laboratory, IBM Corporation, Endicott, NY 13760
2. Innovative Research, Inc., 2520 Broadway Street, NE, Suite 200, Minneapolis, MN 55413
3. University of Minnesota, Minneapolis, MN 55455
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/119/1/58/5566906/58_1.pdf
Reference6 articles.
1. Chu, R. C., 1986, “Heat Transfer on Electronic Systems,” Proceedings of the 8th International Heat Transfer Conference, San Francisco, CA, pp. 293–305.
2. Nakayama, W., 1988, “Thermal Management of Electronic Equipment,” in Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1, A. Bar Cohen and A. Kraus, eds., Hemisphere, Washington, DC, pp. 1–78.
3. Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow, Hemisphere, Washington DC.
4. Stone H. L. , 1968, “Iterative Solution of Implicit Approximations of Multidimensional Partial Differential Equations,” SIAM Journal of Numerical Analysis, Vol. 5, pp. 530–558.
5. Patankar S. V. , 1981, “A Calculation Procedure for Two-Dimensional Elliptic Situations,” Numerical Heat Transfer, Vol. 4, pp. 409–425.
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