A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks
Author:
Affiliation:
1. Shu-Zen College of Medicine and Management, No. 452, Hwan-chio Rd., Luju, Kaohsiung Hsien, Taiwan 82144
2. Department of Electrical Engineering, National Changhua University of Education, No. 2, Shi-Da Rd., Changhua, Taiwan 500
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4000207/5604018/041002_1.pdf
Reference13 articles.
1. Future Optical Fiber Transmission Technology and Networks;Cochrane;IEEE Commun. Mag.
2. GaN Resonant Cavity Light-Emitting Diodes for Plastic Optical Fiber Applications;Shaw;IEEE Photon. Technol. Lett.
3. Microcavity LEDs Coupled to POF Arrays for Parallel Optical Interconnects;Dhoedt
4. 200Mbit/s Data Transmission Through 100m of Plastic Fiber With Nitride LEDs;Akhter;Electron. Lett.
5. Comparison of Surface and Edge-Emitting LED’s for Use in Fiber-Optical Communications;Botez;IEEE Trans. Electron Devices
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1. Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter;Journal of Electronic Packaging;2015-06-01
2. Light Emitting Diode Growth on Curved Gallium Nitride Surfaces;MRS Proceedings;2011
3. Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials;Journal of Electronic Packaging;2010-09-01
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