Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis

Author:

Lu Kuan1,Wang Zhikun2,Chun Heebum1,Lee ChaBum1

Affiliation:

1. Texas A&M University J. Mike Walker ‘66 Department of Mechanical Engineering, , 3123 TAMU, College Station, TX 77843-3123

2. L&T Technology Services (Vendor for Meta Platforms) , 9845 Willows Road Northeast, Redmond, WA 98052

Abstract

Abstract This paper introduces a novel wafer-edge quality inspection method based on analysis of curved-edge diffractive fringe patterns, which occur when light is incident and diffracts around the wafer edge. The proposed method aims to identify various defect modes at the wafer edges, including particles, chipping, scratches, thin-film deposition, and hybrid defect cases. The diffraction patterns formed behind the wafer edge are influenced by various factors, including the edge geometry, topography, and the presence of defects. In this study, edge diffractive fringe patterns were obtained from two approaches: (1) a single photodiode collected curved-edge interferometric fringe patterns by scanning the wafer edge and (2) an imaging device coupled with an objective lens captured the fringe image. The first approach allowed the wafer apex characterization, while the second approach enabled simultaneous localization and characterization of wafer quality along two bevels and apex directions. The collected fringe patterns were analyzed by both statistical feature extraction and wavelet transform; corresponding features were also evaluated through logarithm approximation. In sum, both proposed wafer-edge inspection methods can effectively characterize various wafer-edge defect modes. Their potential lies in their applicability to online wafer metrology and inspection applications, thereby contributing to the advancement of wafer manufacturing processes.

Funder

Directorate for Engineering

National Science Foundation

Publisher

ASME International

Reference39 articles.

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3. Visualizing the Wafer’s Edge;Burkeen,2007

4. Edge and Bevel Automated Defect Inspection for 300 mm Production Wafers in Manufacturing;Morillo,2005

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