An Experimental Investigation of Sintered Particle Effect on Heat Transfer Performance in an “Annular Flow” Evaporation Tube

Author:

Spitzenberger Jeremy1,Hoelle James2,Abdulheiba Ahmed2,Mohammed Ramy H.2,Ismael Laith34,Agonafer Damena5,Wang Pengtao6,Kowalski Stephen6,Nawaz Kashif6,Ma Hongbin2

Affiliation:

1. University of Missouri Department of Mechanical & Aerospace Engineering, , Columbia, MO 65211.

2. University of Missouri Department of Mechanical & Aerospace Engineering, , Columbia, MO 65211

3. University of Missouri Department of Mechanical & Aerospace Engineering, , Columbia, MO 65211 ;

4. University of Technology Department of Mechanical Engineering, , Baghdad , Iraq

5. University of Maryland Department of Mechanical Engineering, , College Park, MD 20742

6. Oak Ridge National Laboratory Building Technologies Research and Integration Center (BTRIC), , Oak Ridge, TN 37831

Abstract

Abstract Wicking structures have been widely used within passive heat transfer devices with high heat fluxes, such as heat pipes, to enhance their thermal performance. While wicking structures promote capillary pumping of the working fluid and thin film evaporation, they can result in capillary evaporation and further enhance the evaporation heat transfer. In this study, a 0.5 mm thick layer of 105 µm sintered copper particles was added to the inner wall of a copper tube, aiming to form an “annular flow” and enhance the heat transfer characteristics by taking advantage of thin film and capillary evaporation. Acetone was chosen as the working fluid, and the performance of an evaporation tube was tested for power inputs of 10, 30, 50, and 70 W. For each power input, trials were run at inclination angles varying from −90 deg to 90 deg to investigate the capillary effects. The temperature measurements showed that the temperature distribution along the evaporation tube is always downward sloping, meaning the temperature at the fluid inlet is larger than the outlet. Results show that an “annular flow” formed by a thin layer of sintered particles can promote thin film and capillary evaporation and, therefore, boost the evaporation heat transfer coefficient.

Publisher

ASME International

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