Forced Convection Heat Transfer From a Low-Profile Block Simulating a Package of Electronic Equipment

Author:

Nakamura Hajime1,Igarashi Tamotsu1

Affiliation:

1. Department of Mechanical Engineering, National Defense Academy, 1-10-20 Hashirimizu, Yokosuka, Kanagawa 239-8686, Japan

Abstract

Forced convection heat transfer from a low-profile block placed in a rectangular duct, simulating heat transfer in a compact packaged electronic device, is investigated experimentally. Local heat transfer from the block is measured by an infrared camera. A general correlation of the Nusselt number for the block is derived using a modified Reynolds number, ReL*=Um/β2L/ν, where Um is mean duct velocity, β is the opening ratio of the duct, and L is the block length. The correlation is shown to be applicable regardless of the configuration of the block and duct, under the conditions of laminar flow, a low-profile block (height/length<0.5), and a low blockage effect (β⩾0.5).

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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