Reliability Prediction of Area Array Solder Joints
Author:
Dudek Rainer1, Do¨ring Ralf1, Michel Bernd1
Affiliation:
1. Fraunhofer-Institut fu¨r Zuverla¨ssigkeit und Mikrointegration (IZM), Otto-Schmerbach-Str. 19, D-09117 Chemnitz
Abstract
Packages for high pin counts using the ball grid array technology or its miniaturized version, the chip scale package, inherently require reliability concepts as an integral part of their development. This is especially true for the latter packages, if they are combined with the flip chip technology. Accordingly, thermal fatigue of the solder balls is frequently investigated by means of the finite element method. Various modeling assumptions and simplifications are common to restrict the calculation effort. Some of them, like geometric modeling assumptions, assumptions concerning the homogeneity of the cyclic temperature fields, simplified creep characterization of solder, and the related application of Manson-Coffin failure criteria, are discussed in the paper. The packages chosen for detailed analyses are a PBGA 272 and a FC-CSP 230.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Dudek, R., Nylen, M., Schubert, A., Michel, B., and Reichl, H., 1997, “An Efficient Approach to Predict Solder Fatigue Life and its Application to SM- and Area Array Components,” Proc. of ECTC 47, San Jose, pp. 462–471. 2. Dudek, R., Schubert, A., and Michel, B., 2000, “Analysis of Flip Chip Attach Reliability,” Proc. Internat. Conference Adhesives in Electronics 2000, Espoo, Finland, pp. 77–85. 3. Barasan, C., Desai, C. S., and Kundu, T., 1998, “Thermomechanical Finite Element Analysis of Microelectronic Packaging, Part I: Theory,” ASME J. Electron. Packag., 120(1), pp. 41–47. 4. Tien, J. K., Hendrix, B. C., and Attarwala, A. I., 1991, “The Interaction of Creep and Fatigue in Lead-Tin Solders,” in Solder Joint Reliability, J. H. Lau (ed.), Van Nostrand Reinhold, pp. 279–305. 5. Hacke, P. L., Sprecher, A. F., and Conrad, H., 1993, “Thermomechanical Fatigue of 63Sn-37Pb Solder Joints,” in Thermal Stress and Strain in Microelectronics Packaging, J. H. Lau (ed.), Van Nostrand Reinhold, pp. 467–499.
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