Essentials of Electronic Packaging
Author:
Viswanadham Puligandla
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Reliability of Electronic Packaging;Springer Handbook of Engineering Statistics;2023
2. Sensing technologies for condition monitoring of oil pump in harsh environment;Sensors and Actuators A: Physical;2022-10
3. Wafer‐Scale Integration;Wiley Encyclopedia of Electrical and Electronics Engineering;2022-02-17
4. Role of Adhesion Phenomenon in the Reliability of Electronic Packaging;Adhesion in Microelectronics;2014-09-12