The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows

Author:

Ishizuka Masaru1,Nakagawa Shinji1,Honma Toru1

Affiliation:

1. Toyama Prefectural University, Kosugi, Toyama, Japan

Abstract

Cooling performances of small finned heat sinks were investigated in combined natural and forced air convection environment, and the way to use the data in designing a heat sink on a LSI package is explored. An experimental study was performed providing natural and forced air convection over the heat sink. Several heat sinks having different base areas, fin spacing and heights were tested. The test heat sink was heated up by an electrical heater to produce a specific heat flux on its base. The increase in fin temperature was measured by small thermocouples. In natural convection experiments, the effect of the supplied wattage on the temperature rise of the heat sink was examined. In forced convection experiments, a wind tunnel was used. The hear sink was set near the downstream end of the wind tunnel and a specific heat flux was applied to it. A correlation between the air velocity and the temperature rise of the heat sinks was developed. Furthermore, the results are reduced to non-dimensional expressions to facilitate the design of small heat sinks.

Publisher

ASMEDC

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Characterization and Analysis of Low Profile Plate-Fin Heat Sinks for Advanced Thermal Packaging of Consumer Electronics;Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology;2005-01-01

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