Flow Analysis in a Chip Cavity During Semiconductor Encapsulation-Reference-Cited by-同舟云学术

Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

Published:1999-01-11 Issue:2 Volume:122 Page:160-167
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Han S.¹,Wang K. K.¹

Affiliation:

1. Sibley School of Mechanical and Aerospace Engineering, Cornell University, B60 Rhodes Hall, Ithaca, New York 14853

Abstract

In this paper, methods to analyze the flow during semiconductor chip encapsulation have been developed. A numerical method is used for the flow analysis in the chip cavity. In this study, for accurate analysis of flow in the chip cavity, models for the cross flow through the leadframe openings have been developed. The models have been verified by comparing with two experiments. In the first experiment, clear polymer and transparent mold have been used for the visualization of flow in a cavity with a leadframe. In the next experiment, actual epoxy molding compound together with an industrial encapsulation process have been used to observe the melt-front advancement shapes. The calculated and experimental results show good agreement. [S1043-7398(00)00902-6]

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/122/2/160/5882163/160_1.pdf

Reference12 articles.

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4. Bird, R. B., Armstrong, R. C., and Hassager, O., 1987, Dynamics of Polymeric Liquids, Vol. 1, Wiley-Interscience, New York.

5. Hieber, C. A., and Shen, S. F., 1980, “A Finite-Element/Finite-Difference Simulation of the Injection-Molding Filling Process,” J. Non-Newtonian Fluid Mech., 7, pp. 1–32.

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