Numerical Investigation of Heat Transfer in Rectangular Microchannels Under H2 Boundary Condition During Developing and Fully Developed Laminar Flow

Abstract

Study of fluid flow characteristics at microscale is gaining importance with shrinking device sizes. Better understanding of fluid flow and heat transfer in microchannels will have important implications in electronic chip cooling, heat exchangers, MEMS, and microfluidic devices. Due to short lengths employed in microchannels, entrance header effects can be significant and need to be investigated. In this work, three dimensional model of microchannels, with aspect ratios (α = a/b) ranging from 0.1 to 10, are numerically simulated using CFD software tool fluent. Heat transfer effects in the entrance region of microchannel are presented by plotting average Nusselt number as a function of nondimensional axial length x*. The numerical simulations with both circumferential and axial uniform heat flux (H2) boundary conditions are validated for existing data set for four wall heat flux case. Large numerical data sets are generated in this work for rectangular cross-sectional microchannels with heating on three walls, two opposing walls, one wall, and two adjacent walls under H2 boundary condition. This information can provide better understanding and insight into the transport processes in the microchannels. Although the results are seen as relevant in microscale applications, they are applicable to any sized channels. Based on the numerical results obtained for the whole range, generalized correlations for Nusselt numbers as a function of channel aspect ratio are presented for all the cases. The predicted correlations for Nusselt numbers can be very useful resource for the design and optimization of microchannel heat sinks and other microfluidic devices.