Stress Concentration Factors at an Elliptical Hole on the Interface Between Bonded Dissimilar Half-Planes Under Bending Moment

Abstract

The problem of thin plate bending of two bonded half-planes with an elliptical hole on the interface and interface cracks on its both sides is presented. A uniformly distributed bending moment applied at the remote ends of the interface is considered. The complex stress functions approach together with the rational mapping function technique are used in the analysis. The solution is obtained in closed form. Distributions of bending and torsional moments, the stress concentration factor as well as the stress intensity factor, are given for all possible dimensions of the elliptical hole, various material constants, and rigidity ratios.