Pumpless Loop for Narrow Channel and Micro-Channel Boiling

Author:

Mukherjee Swaraj1,Mudawar Issam1

Affiliation:

1. Purdue University International Electronic Cooling Alliance (PUIECA), West Lafayette, IN 47907

Abstract

A compact cooling system is examined which capitalizes upon fluid density differences between two vertical, parallel, interconnected tubes to achieve a pumpless cooling loop. A heat-dissipating device is incorporated into a boiler at the bottom of the hot tube. The large density differences between the two tubes produces a substantial nonequilibrium in hydrostatic pressure, drawing liquid downwards through the cold tube as a two-phase mixture is released upwards in the hot tube. Cooling with this pumpless loop is fundamentally different from, and far superior to, pool boiling thermosyphons because of the former’s ability to separate the path of replenishment liquid from that of the released vapor. Experiments were performed to explore the effects of boiler gap (separation distance between the boiling surface and opposite insulating wall) on cooling performance and critical heat flux (CHF) for water and FC-72. The gap, which is the primary measure of boiler miniaturization, was varied from 0.051 to 21.46 mm. For large gaps, CHF showed insignificant dependence on the gap for both fluids. However, small gaps produced CHF variations that were both drastic and which followed opposite trends for the two fluids. Decreasing the gap below 3.56 mm produced a substantial rise in CHF for FC-72. For water, CHF was fairly insensitive down to 0.51 mm, below which it began to decrease sharply. These trends are shown to be closely related to the small surface tension and contact angle of FC-72 producing very small bubbles which can easily pass through narrow gaps in FC-72, while much larger bubbles in water obstruct liquid replenishment in narrow gaps. A numerical model is constructed to determine how the gap influences the various components of pressure drop, velocities, coolant flow rate, and hence system response to heat input.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Cited by 82 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3