Stress Singularities at the Interface in Bonded Dissimilar Materials Under Mechanical and Thermal Loading

Author:

Munz D.1,Yang Y. Y.1

Affiliation:

1. Institute for Reliability and Failure Analysis, University of Karlshuhe, W-7500 Karlsruhe, Federal Republic of Germany

Abstract

Stress singularities occur at the free edge of the interface of bonded dissimilar materials. General relations for a compound with 90-degree angles of the two materials are given for the parameters which describe the stress field. Differences between mechanical and thermal loadings are discussed.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

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