Affiliation:
1. Singapore Polytechnic, Singapore
2. Department of Mechanical Engineering, University of Wisconsin, Madison, Wisc.
Abstract
A model in terms of grain distributions and kinematic conditions has been recently developed [8] for a specified grinding process. Using this model, an exploratory attempt was made to study the grinding process with respect to the surface topography and nature of surface interactions by simulation on a digital computer. Fundamental grinding parameters, such as the effective grain density, grain spacings, chip depths, and chip areas, are employed to describe the grain-workpiece interactions. The grinding process is studied under a systematic variation of table speed, wheel depth of cut, and grain apex angle. The physical significance of the Z-distribution and stochastic nature of the grinding process is also discussed.
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39 articles.
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