Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation-Reference-Cited by-同舟云学术

Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation

Published:2004-03-01 Issue:1 Volume:126 Page:87-93
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Shah Mithilesh¹,Zeng Kaiyang²,Tay Andrew A. O.³

Affiliation:

1. Singapore-MIT Alliance, National University of Singapore, Singapore

2. Institute of Materials Research and Engineering, Singapore

3. Dept. of Mechanical Eng., National University of Singapore, Singapore

Abstract

The present work studies the mechanical properties of mechanically polished gold wire and wirebond using nanoindentation. Metallography of wirebond reveals undesirable coarse grain structure in HAZ due to recrystallization and grain growth. For our gold wire, the recrystallization temperature found using D.S.C. was 340.66°C and the dopants were identified using TOF-SIMS and hardness dependence on load was studied using nanoindentation. The nanoindentation of wirebond has confirmed a v-shaped hardness profile with minima at 166 μm along the HAZ. The elastic modulus varied independent of the microstructure. A yield stress profile based on empirical hardness-yield strength correlation is predicted for the wirebond.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/126/1/87/5559376/87_1.pdf

Reference13 articles.

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