Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications-Reference-Cited by-同舟云学术

Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications

Published:2003-06-01 Issue:2 Volume:125 Page:302-307
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Mead Patricia F.¹,Ramamoorthy Aravind¹,Pal Shapna¹,Fathi Z.²,Ahmad I.³

Affiliation:

1. CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742

2. Lambda Technologies Inc. Morrisville, NC 27560

3. Lambda Technologies, Inc., Morrisville, NC 27560

Abstract

This paper discusses an innovative technique for rapid cure of polymeric encapsulants such as underfills used in direct chip attach devices using variable frequency microwaves (VFM). VFM processing reduces the cure time for underfill encapsulants to 10 min or less, as compared to 30 or more minutes when using convection oven methods. We report here the results of our investigations measuring key material attributes of VFM and conventionally cured underfill encapsulant samples, and we also have characterized voiding and delamination characteristics of flip-chip with underfill test structures. Finally, particle settling in the flip-chip with underfill test structures has been characterized. Our results show that the VFM technique produces underfill attributes that are comparable to conventionally cured samples.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/125/2/302/5802541/302_1.pdf

Reference34 articles.

1. Anderson, B., Ahmad, I., Tucker, D., Goldstein, S., Fathi, Z., Ramamoorthy, A., Pal, S., and Mead, P., 1998, “Rapid Processing and Properties Evaluation of Flip-Chip Underfills,” Proc., Technical Program NEPCON West ’98 Conference, Vol. 3, Anaheim, CA, pp. 1043–1051.

2. Copson, D., 1962, Microwave Heating: In Freeze Drying, Electronic Ovens and Other Applications, Avi Publishing Company, Westport, CN.

3. Ramamoorthy, A., and Mead, P. F. 1999, “Investigation of variable frequency microwaves for cure of flip chip underfills,” Proceedings of InterPACK ’99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference ’Advances in Electronic Packaging 1999, Maui, HI, ASME EEP-26 (2), pp. 1569–1572.

4. Mead, P. F., and Broadwater, K., 2000, “In-Fiber Strain Characterization of Fiber Optic Connector Assemeblies Via Bragg Grating Sensors,” Appl. Opt., 39(28), pp. 5101–5108.

5. Fathi, Z., Tucker, D. A., Wei, B. J., Garard, R. S., Mead, P. F., Balaji, P. and Hutchins, C. L. 1997. “Rapid cure of liquid encapsulants and structural adhesives for electronics packaging using variable frequency microwave (VFM) energy,” Proc., Electronic Packaging Materials Science IX Symposium, Boston, eds., S. K. Groothuis, P. S. Ho, K. Ishida, and T. Wu, pp. 125–130.

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multiscale, Multiphysics Model of Underfill Flow for Flip-Chip Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-06

2. A multiscale modeling and experimental study of underfill flow and void formation for flip-chip packages;2009 59th Electronic Components and Technology Conference;2009-05

3. Open ended microwave oven for packaging;2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS;2008-04

4. Variable Frequency Microwave Curing of Amide-Epoxy Based Polymers;IEEE Transactions on Components and Packaging Technologies;2007-09

5. Lead-free interconnect technique by using variable frequency microwave;Journal of Electronic Materials;2005-07