Discussion: “Modeling of Flash Temperature for Elastic Sliding Contact of Single Micro-Asperity Pair” (Wu, Z., Zhang, Y., Xu, Y., Jie, D., and Jackson, R. L., 2024, ASME J. Tribol., 146(1), p. 011702)

Author:

Jackson R. L.1,Wu Z.2,Xu Y.2,Green I.3

Affiliation:

1. Auburn University Department of Mechanical Engineering, , Auburn, AL 36849

2. Hefei University of Technology School of Mechanical Engineering, , Hefei 230009 , China

3. Georgia Institute of Technology Woodruff School of Mechanical Engineering, , Atlanta, GA 30332

Publisher

ASME International

Reference17 articles.

1. Modeling of Flash Temperature for Elastic Sliding Contact of Single Micro-Asperity Pair;Wu;ASME J. Tribol.,2024

2. An Elastic-Plastic Finite Element Analysis of Two Interfering Hemispheres Sliding in Frictionless Contact;Green;Phys. Sci. Int. J.,2018

3. An Analysis of Elasto-Plastic Sliding Spherical Asperity Interaction;Jackson;Wear,2007

4. Moody, J. , 2007, “A Finite Element Analysis of Elastic-Plastic Sliding of Hemispherical Contacts,” Master of Science, Georgia Institute of Technology, Atlanta, GA.

5. Molecular Scale Analysis of Dry Sliding Copper Asperities;Vadgama;Appl. Nanosci.,2015

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