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2. Akay, H. U., Zhang, H., and Paydar, N. H., 1997, “Experimental Correlation of an Energy-Based Fatigue Life Prediction Method for Solder Joints,” Proc. ASME InterPACK’97, pp. 1567–1574.
3. Akay, H. U., Kaliappan, G., Paydar, N. H., and Rassaian, M., 1999, “A Study of Fatigue Life Predictions for PBGA Joints and Comparisons with Test Data,” Proc., ASME InterPACK’99, pp. 677–684.
4. Yao, Q., and Qu, J., 1999, “Effects of PWB Size on the Warpage of Flip Chip Assemblies,” Proc., ASME InterPACK’99, pp. 27–31.
5. Sakai, H., Ito, N., Kawase, K., Imamura, K., Ohno, M., and Motegi, M., 1999, “Thermal Fatigue Life Evaluation for The Solder Joint Ceramic BGA,” Proc., ASME InterPACK’99, pp. 255–261.