Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Author:

Lee T.-Y. Tom1,Sharma R.2,Peyre-Lavigne A.2

Affiliation:

1. Advanced Interconnect Systems Laboratories, Motorola, Inc., 2100 E. Elliot Road, Mail Drop EL725, Tempe, AZ 85284

2. Transportation Systems Group, Motorola, Inc., Le Mirail, B. P. 1029, 31023 Toulouse Cedex, France

Abstract

This paper summarizes thermal modeling work performed on the Motorola Carbon Monoxide (CO) chemical sensor. Gas sensors need low cost reliable packages, good thermal operation, and low power consumption. The goal is to provide a validated thermal model of a gas sensor and its package and to develop a sensor design capability with reduced design cycle time. Due to the complex structure of the sensor package, a computational fluid dynamics (CFD) tool was used to analyze the heat transfer and fluid flow within the package. Based on the validated model, parametric studies on filter location and package orientation were performed. In order to minimize the influence of humidity, the sensor is toggled between high and low temperatures by applying 5 volts for 5 s of heating, and 1 volt for 10 s of cooling. Transient thermal analysis was also performed to predict the temperature response of various components. A detailed description of the thermal model and its results are described in the paper.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference6 articles.

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2. Fung, S. K. H., Tang, Z., Chan, P. C. H., Sin, J. K. O., and Cheung, P. W., 1995, “Thermal Analysis and Design of a Micro-Hotplate for Integrated Gas Sensor Applications,” Proceedings of the 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX, Vol. 1, pp. 818–821.

3. Lee, D.-D., Chung, W.-Y., Kim, T.-H., and Baek, J.-M., 1995a, “Low Power Micro Gas Sensor,” Proceedings of the 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX, Vol. 1, pp. 827–830.

4. Lee T. Y. , ChambersB., and MahalingamM., 1995b, “Application of CFD Technology to Electronic Thermal Management,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, Vol. 18, No. 3, pp. 511–520.

5. Paula, G., 1996, “MEMS Sensors Branch Out,” Mechanical Engineering, ASME, NY, pp. 64–68.

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