Adhesion and Friction Studies of Silicon and Hydrophobic and Low Friction Films and Investigation of Scale Effects
Author:
Bhushan Bharat1, Liu Huiwen1, Hsu Stephen M.2
Affiliation:
1. Nanotribology Laboratory for Information, Storage and MEMS/NEMS, The Ohio State University, 206 W 18th Avenue, Columbus, OH 43210-1107 2. National Institute of Standards and Technology, Gaithersburg, MD 20899
Abstract
Tribological properties are crucial to the reliability of microelectromechanical systems/nanoelectromechanical systems (MEMS/NEMS). In this study, adhesion and friction measurements are made at micro and nanoscales on single-crystal silicon (commonly used in MEMS/NEMS) and hydrophobic and low friction films. These include diamondlike carbon (DLC), chemically bonded perfluoropolyether (PFPE), and self-assembled monolayer (SAM) films. Since MEMS/NEMS devices are expected to be used in various environments, measurements are made at a range of velocities, humidities, and temperatures. The relevant adhesion and friction mechanisms are discussed. It is found that solid films of DLC, PFPE, and SAM can reduce the adhesion and friction of silicon. These films can be used as anti-adhesion films for MEMS/NEMS components under different environments and operating conditions. Finally, the adhesion and friction data clearly show scale dependence. The scale effects on adhesion and friction are also discussed in the paper.
Publisher
ASME International
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference32 articles.
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