Effect of Nanoparticle Coating on the Performance of a Miniature Loop Heat Pipe for Electronics Cooling Applications

Author:

Tharayil Trijo1,Godson Asirvatham Lazarus2,Rajesh S.3,Wongwises Somchai4

Affiliation:

1. Department of Mechanical Engineering, Karunya University, Coimbatore 641 114, Tamil Nadu, India e-mail:

2. Department of Mechanical Engineering, Karunya University, Coimbatore 641 114, Tamil Nadu, India e-mails: ;

3. Department of Nanotechnology, Karunya University, Coimbatore 641 114, Tamil Nadu, India e-mail:

4. Fluid Mechanics, Thermal Engineering and Multiphase Flow Research Lab (FUTURE), Department of Mechanical Engineering, Faculty of Engineering, King Mongkut’s University of Technology Thonburi, Bangmod, Bangkok 10140, Thailand e-mail:

Abstract

The effect of nanoparticle coating on the performance of a miniature loop heat pipe (mLHP) is experimentally investigated for heat inputs of 20–380 W using distilled water as the working fluid. Applications include the cooling of electronic devices such as circuit breaker in low voltage switch board and insulated gate bipolar transistor. Physical vapor deposition method is used to coat the nanoparticles on the evaporator surface for different coating thicknesses of 100 nm, 200 nm, 300 nm, 400 nm, and 500 nm, respectively. An optimum filling ratio (FR) of 30% is chosen for the analysis. Experimental findings show that the nanoparticle coating gives a remarkable improvement in heat transfer of the heat pipe. An average reduction of 6.7%, 11.9%, 17.2%, and 22.6% in thermal resistance is observed with coating thicknesses of 100 nm, 200 nm, 300 nm, and 400 nm, respectively. Similarly, enhancements in evaporator heat transfer coefficients of 47%, 63.5%, 73.5%, and 86% are noted for the same coating thicknesses, respectively. Evaporator wall temperature decreased by 15.4 °C for 380 W with a coating thickness of 400 nm. The repeatability test ensures the repeatability of experiments and the stability of coatings in the long run.

Funder

Science and Engineering Research Board

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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