1. Aakalu, N. G., Chu, R. E., and Simons, R. E., 1973, “Cooling System for Data Processing Equipment,” U.S. Patent No. 3,741,292.
2. External Two Phase Thermosiphons for Cooling of Electronic Components;Tengblad;Int. J. Microcircuits Electron. Packag.
3. Cooling of Electronics by Heat Pipes and Thermosyphons—A Review of Methods and Possibilities;Palm
4. Performance of a Compact Two-Phase Thermosyphon: Effect of Evaporator Inclination, Liquid Fill Volume and Contact Resistance;Ramaswamy
5. Compact Thermosyphons Employing Microfabricated Components;Ramaswamy;Microscale Thermophys. Eng.