High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux-Reference-Cited by-同舟云学术

High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux

Published:2014-05-05 Issue:3 Volume:136 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Wang Fuliang¹,Li Junhui²,Han Lei²

Affiliation:

1. State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha, HN Province 410083, China e-mail:

2. State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha, HN Province 410083, China

Abstract

Lead-free solder balls are environment friendly; however, they require a high bonding temperature, which causes problems in the microelectronics package industry. To reduce the bonding temperature, a 60 kHz high-frequency thermosonic bonding method is proposed and realized using a lab bonder. Experimental results showed that this method could be used to bond a 300 μm-diameter Sn–Ag–0.5Cu microsolder ball onto a silver pad without flux at a low temperature of 160 °C in 3 s. A ball shear test showed that the high frequency led to a high bonding strength of 58.8 MPa, and a dimpled structure was observed at the bonding interface by SEM. Compare with the reflow method or laser soldering method, the proposed method requires a low bonding temperature and leads to a high bonding strength.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4026877/6139987/ep_136_03_031001.pdf

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