Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition-Reference-Cited by-同舟云学术

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

Published:2004-03-01 Issue:1 Volume:126 Page:41-47
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Cho Seungmin¹,Han Bongtae¹,Joo Jinwon²

Affiliation:

1. CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742

2. Department of Mechanical Engineering, Chungbuk National University, Cheongju Chungbuk, Korea

Abstract

A robust scheme of moire´ interferometry for real-time observation is employed to study the temperature dependent thermo-mechanical behavior of a ceramic ball grid array package assembly. The scheme is implemented with a convection-type environmental chamber that provides the rapid temperature control required in accelerated thermal cycling. Thermal deformations are documented at various temperatures. Thermal-history dependent analyses of global and local deformations are presented. A significant nonlinear global behavior is documented due to complete stress relaxation at the maximum temperature. An analysis of solder interconnections reveals that inelastic deformation accumulates at the bottom eutectic solder fillet only at high temperatures.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/126/1/41/5559063/41_1.pdf

Reference29 articles.

1. Darveaux, R., and Mawer, A., 1995, “Thermal and Power Cycling Limits of Plastic Ball Grid Array (PBGA),” Proceedings of Surface Mount International, pp. 315–325.

2. Darveaux, R., Banerji, K., Mawer, A., and Doddy, G., 1994, “Chap. 13 Reliability of Ball Grid Array Solder Joints,” Ball Grid Array Technology J. H. Lau, ed., McGraw-Hill.

3. Syed, A., 1997, “A Review of Finite Element Methods for Solder Joint Analysis,” B. Han, R. Mahajan and D. Barker, eds., Experimental/Numerical Mechanics in Electronics Packaging, Vol. 1, Society for Experimental Mechanics, Bethel, CT.

4. Bastawros, A. F., and Voloshin, A. S., 1990, “Transient Thermal Strain Measurements in Electronic Packages,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 13(4), pp. 961–966.

5. Bastawros, A. F., and Voloshin, A. S., 1990, “In Situ Calibration of Stress Chips,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 13(4), pp. 888–892.

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