Viscous Dissipation in Finite Thin-Gap Couette Devices-Reference-Cited by-同舟云学术

Viscous Dissipation in Finite Thin-Gap Couette Devices

Published:2001-06-25 Issue:1 Volume:124 Page:200-203
ISSN:0022-1481
Container-title:Journal of Heat Transfer
language:en
Short-container-title:

Author:

Wendl Michael C.¹,Agarwal Ramesh K.²

Affiliation:

1. Research Associate and Affiliate Professor, School of Medicine and Department of Mechanical Engineering, Washington University, 4444 Forest Park Blvd., Box 8501, Saint Louis, MO 63108

2. The William Palm Professor, Department of Mechanical Engineering, Washington University, 1 Brookings Drive, Box 1185, Saint Louis, MO 63130

Abstract

An analytical solution is reported for the temperature distribution in finite span thin-gap Couette devices which accounts for viscous dissipation. Taken in conjunction with an established solution for the stable velocity profile, this result describes the standard experimental configuration where no external heat fluxes are applied. We discuss physical aspects as well as conditions for which classical one-dimensional theory should be replaced by the present result.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://asmedigitalcollection.asme.org/heattransfer/article-pdf/124/1/200/5549684/195_1.pdf

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