Synergistic Effect of Additives on the Surface Roughness and Throwing Power of Copper Deposited from Electrorefining Solution-Reference-Cited by-同舟云学术

Synergistic Effect of Additives on the Surface Roughness and Throwing Power of Copper Deposited from Electrorefining Solution

Author:

Suzuki Atsuhiro¹,Oue Satoshi²,Kobayashi Shigeo³,Nakano Hiroaki²

Affiliation:

1. Department of Materials Process Engineering, Kyushu University

2. Department of Materials Science & Engineering, Kyushu University

3. Department of Applied Chemistry and Biochemistry, Kyushu Sangyo University

Publisher

Japan Institute of Metals

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

Reference20 articles.

1. 1) C. L. Mantell: Electrochemical Engineering, (McGraw-Hill Book Company, Inc., New York, NY, U.S.A., 1960) pp. 142-167, 185-192, 210-224.

3. 5) K. Shimokawa: Thesis for doctoral degree, (Kyoto University, 2013) pp. 19-22.

4. 6) S. Goto, I. Asakura and C. Oshima: J. Min. Metall. Inst. Jpn. 91(1975) 131-136.

5. 7) S. Goto, O. Ogawa, I. Asakura and C. Oshima: J. Min. Metall. Inst. Jpn. 88(1972) 99-102.

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