Damping Capacities of Ti50Ni50−xCux Shape Memory Alloys Measured under Temperature, Strain, and Frequency Sweeps
Author:
Affiliation:
1. Department of Materials Science and Engineering, National Taiwan University
2. Department of Mechanical Engineering, National Taiwan University
3. Department of Chemical and Materials Engineering, National I-Lan University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/56/2/56_M2014304/_pdf
Reference37 articles.
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2. 2) S. Miyazaki and K. Otsuka: ISIJ Int. 29 (1989) 353–377.
3. 3) K. Otsuka and C. M. Wayman: Shape Memory Materials, (Cambridge University Press, Cambridge, 1998) pp. 1–96.
4. 4) K. Otsuka and T. Kakeshita: MRS Bull. 27 (2002) 91–100.
5. 5) J. Van Humbeeck: J. Alloy. Compd. 355 (2003) 58–64.
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