Surface Mounting Process Using Hybrid Resin Sheet Including Self-Organizable Solder Particles-Reference-Cited by-同舟云学术

Surface Mounting Process Using Hybrid Resin Sheet Including Self-Organizable Solder Particles

Published:2013 Issue:6 Volume:54 Page:899-904
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Fukumoto Shinji¹,Inoue Shu²,Wakimoto Ryoichi²,Yamamoto Yuto²,Matsushima Michiya¹,Fujimoto Kozo¹

Affiliation:

1. Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

2. Graduate School of Engineering, Osaka University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/54/6/54_MD201204/_pdf

Reference12 articles.

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3. 3) M.-L. Sham and J.-K. Kim: J. Adhes. Sci. Technol. 17 (2003) 1923–1944.

4. 4) K. Ohta, M. Toya, K. Yasuda, M. Matsushima and K. Fujimoto: Proc. Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International, 4–6 Nov. 2008 Penang, Malaysia, (2008) pp. 1–5.

5. 5) K. Ohta, K. Yasuda, M. Matsushima and K. Fujimoto: Proc. 12th Symp. on Microjoining and Assembly Technology on Electronics, Yokohama, Japan, (2006) pp. 381–386.

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