Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate

Published:2006 Issue:4 Volume:47 Page:1232-1239
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Chen Chih-Yuan¹,Chen Hao-Long²,Hwang Weng-Sing¹

Affiliation:

1. Department of Materials Science and Engineering, National Cheng Kung University

2. Department of Electronic Engineering, Kao Yuan University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/47/4/47_4_1232/_pdf

Reference17 articles.

1. 1) V. A. Altekar, S. K. Banerjee, B. N. Ghose and J. Bhattacharya: NML Technical Journal 23 (1981) 32–36.

2. 2) N. Bay: Met. Const. (1986) 486.

3. 3) Koga and Shinji: Journal of the Japan Welding Society 72 (2003) 49–52.

4. 4) A. Yahiro, T. Masui, T. Yoshida and D. Doi: ISIJ International 31 (1991) 467–654.

5. 5) M. Abbasi, M. T. Salehi and A. K. Taheri: Z. Metallkd. 92 (2001) 423–430.

Cited by 136 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The crucial role of accumulated strain and Cu content on the electrical, thermal, tensile, fracture, and microstructure characteristics of Al/Cu multi-layered composites subjected to SPD;Materials Today Communications;2024-12

2. High-temperature tribological behavior of the Al/Mg/Cu multilayered composite produced by the severe plastic deformation;Tribology International;2024-11

3. Steel–Steel Laminates Manufactured via Accumulative Roll Bonding;steel research international;2024-09-09

4. Achieving excellent bond strength and tensile strength synergy of ultrafine-grained Al/Cu bimetallic sheets developed by an innovative hybrid manufacturing process;Journal of Materials Processing Technology;2024-09

5. Electrode life evaluation for varied electrode material composition and geometry in resistance spot welding of aluminum alloys;Welding in the World;2024-08-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3