Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System
Author:
Affiliation:
1. Graduate School, Tokyo Institute of Technology
2. Department of Materials Science and Engineering, Tokyo Institute of Technology
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/59/2/59_MC201712/_pdf
Reference50 articles.
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3. 3) M. Onishi and H. Fujibuchi: Trans. JIM 16 (1975) 539–547. 10.2320/matertrans1960.16.539
4. 4) H.N. Keller: IEEE Trans. Compon. Hybrids. Manuf. Tech. CHMT-2 (1979) 180–195. 10.1109/TCHMT.1979.1135443
5. 5) H.N. Keller and J.M. Morabito: Surf. Interface Anal. 3 (1981) 16–22. 10.1002/sia.740030108
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