Thermal Fluid Simulation Modeling Based on Thermal Transient Test and Fatigue Analysis of Asymmetric Structural Double-Sided Cooling Power Module-Reference-Cited by-同舟云学术

Thermal Fluid Simulation Modeling Based on Thermal Transient Test and Fatigue Analysis of Asymmetric Structural Double-Sided Cooling Power Module

Published:2021-01-01 Issue:1 Volume:24 Page:130-142
ISSN:1343-9677
Container-title:Journal of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Hara Tomoaki¹²,Aoki Yoshitaka¹,Funaki Tsuyoshi²

Affiliation:

1. Siemens DI Software, Presales Division, Siemens K.K.

2. Division of Electrical, Electronic, and Information Engineering, Osaka University

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/24/1/24_JIEP-D-19-00122/_pdf

Reference36 articles.

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2. 2) C. Gillot, C. Schaeffer, C. Massit, and L. Meysenc: "Double-sided cooling for high power IGBT modules using flip chip technology," in IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 698–704, Dec. 2001.doi: 10.1109/6144.974963

3. 3) K. Hamada: "Present status and future prospects for electronics in electric vehicles/hybrid electric vehicles and expectations for wide-bandgap semiconductor devices," Physica Status Solidi (b), Vol. 245, Issue 7, 2008, pp. 1223–1231, doi: 10.1002/pssb.200844079

4. 5) T. Kimura, R. Saitou, K. Kubo, K. Nakatsu, H. Ishikawa, and K. Sasaki: "High-power-density inverter technology for hybrid and electric vehicle applications," Hitachi Review, Vol. 63, pp. 96–102, 2014

5. 6) K. Nakatsu and R. Saito: "The next-generation high power density inverter technology for vehicle," 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE ASIA), Hiroshima, 2014, pp. 1925–1928, doi: 10.1109/IPEC.2014.6869850

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