Preparation and Property Evaluations of Liquid Non-Solvent Solder Resists which Can be Developed with Alkaline Solution
Author:
Affiliation:
1. Taiyo Holdings co., Ltd.
2. Yokohama National University
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/19/3/19_189/_pdf
Reference9 articles.
1. 1) K. Takagi, H. Honma, and T. Sasabe: “Development of Sequential Build-Up Multilayer Printed Wiring Boards in Japan,” IEEE Electr. Insul. Mag., Vol. 19, No. 5, pp. 27-56, 2003
2. 2) F. J. Rendulic, R. K. Trasavage, and P. A. Boduch: “Method and apparatus for making printed circuit boards,” U. S. Patent: 4436806
3. 3) T. Nishikubo: “Synthesis of Diacrylate by Addition Reaction between Epoxy Resin and Acrylic Acid in the Presence of Polyfunctional Acrylates,” Kobunshi Ronbunshu, Vol. 35, No. 10, pp. 673-675, 1978
4. 4) T. Aoai: “Recent Progress of Highly Sensitive Photo-Polymerization Initiation,” Journal of Synthetic Organic Chemistry, Japan, Vol. 66, No. 5, 2008
5. 5) M. Ohwa: “Recent Aspects in Photoinitiators,” Journal of Printing Science and Technology, Vol. 40, No. 3, 2003
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermo‐mechanical properties of epoxy composites filled with inorganic particulate fillers for robust solder mask application;Polymer International;2024-05-20
2. Recent developments in advanced polymeric materials for solder mask application: Progress and challenges;Journal of Science: Advanced Materials and Devices;2023-09
3. Characterization of Commercial Solder Mask in Printed Circuit Board Application;Springer Proceedings in Materials;2023
4. The Modern Technology Trend of Solder Resist and Interlayer Insulating Material for Printed Circuit Boards;Journal of The Japan Institute of Electronics Packaging;2018-05-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3