Features of Heat-Resistant Jointing Material That Replaces High-Temperature Lead Solder-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Features of Heat-Resistant Jointing Material That Replaces High-Temperature Lead Solder

Published:2009 Issue:4 Volume:12 Page:340-345
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Kato Rikiya,Yamagata Sakie,Okamoto Masahide,Ikeda Osamu

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep/12/4/12_4_340/_pdf

Reference3 articles.

1. 1) "高温鉛はんだ代替技術の現状と開発課題に関する調査 2005",新エネルギー.産業技術総合開発機構

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reduction of Particle-Wall Friction and Separation of Mixed Particles by Ultrasonic;Journal of the Society of Powder Technology, Japan;2016

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP