Author:
Takagi Kanji,Yu Qiang,Shibutani Tadahiro,Miyauchi Hiroki,Noro Yukihiro
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Reference20 articles.
1. 1) K. Hirohata, T. Kawakami, M. Mukai, N. Kawamura, Q. Yu and M. Shiratori: “Stochastic Structural Reliability Design for Electronics Packages Using Response Surface Methodology and Bayes' Theory”, Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference (InterPACK2001), pp. 1–8, 2001
2. 2) L. S. Goldmann: “Geometric Optimization of Controlled Collapse Interconnections”, IBM Journal of Research and Development, Vol. 13, May, pp. 251–265, 1969
3. Prediction of Solder Joint Geometries in Array-Type Interconnects
4. 4) D. N. Staicopolus: “The Computation of Surface Tension and of Contact Angle by The Sessile-Drop Method”, Journal of Colloid Science, Vol. 17, pp. 439–447, 1962
5. 5) J. F. Paddy and A. Pitt: “Axisymmetric Meniscus Profiles”, Journal of Colloid Science, Vol. 38, No. 2, February, pp. 323–334, 1969
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