Influence of Crystallographic Structure on Etching Rate of Copper by Using Ammonium Peroxodisulfate Solution-Reference-Cited by-同舟云学术

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Influence of Crystallographic Structure on Etching Rate of Copper by Using Ammonium Peroxodisulfate Solution

Published:2012 Issue:3 Volume:15 Page:197-204
ISSN:1343-9677
Container-title:Journal of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Kubota Kenji,Niiyama Takashi,Matsumoto Katsutoshi,Yoshihara Sachio

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/15/3/15_197/_pdf

Reference14 articles.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructural characterization of copper coatings in development for application to used nuclear fuel containers;Journal of Nuclear Materials;2020-04

2. Influence of Cleaning and Soft Etching for Electroless Palladium/Gold Plating on Copper Fine Pattern;Journal of The Surface Finishing Society of Japan;2017-08-01

3. Influence of Crystalline Texture on Etching Rate of Copper by Use of Sulfuric Acid/Hydrogen Peroxide Etching Solution;Journal of The Japan Institute of Electronics Packaging;2013

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