Infrared nondestructive detection of defective visible-reflective solder joints in solenoid coil connectors

Author:

Dong Zhao1,Oviedo-Tolentino Francisco2,Hernandez-Guerrero Abel3,Giron-Palomares Benjamin4ORCID

Affiliation:

1. Department of Electronic Information and Electrical Engineering, Anyang Institute of Technology, Anyang, China

2. Engineering Faculty, Autonomous University of San Luis Potosi, San Luis Potosi, San Luis Potosí, Mexico

3. Mechanical Engineering Department, University of Guanajuato, Guanajuato, Mexico

4. Engineering Training Center, Anyang Institute of Technology, Anyang, China

Abstract

Nondestructive infrared detection of solder defects in solenoid coil connectors was investigated. A detailed experimental setup and a meticulous and repeatable experimental procedure were developed. The experimental methods were firmly based on the application of heat transfer science. Time averaged excess temperature ([Formula: see text]) was the sole discrimination parameter, and a difference larger than 2°C between good and defective solders was conservatively considered for good discrimination. Analysis of variance determined the minimum differences in [Formula: see text] between good and defective solder joints. The effects in discriminability of heating time ( th), time integration interval length ( ti), region of interest (ROI) geometry, and solder radiative properties were investigated. A rectangular ROI tightly enclosing the good solder was found as the best discrimination ROI. Matte black paint increasing radiative emission of solder joints significantly reduced discriminability. The defects were discriminated from the good solder for a rectangular ROI, th = 78 s, and ti = 20 s. Moreover, an excellent total inspection time of 34 s per solenoid coil is obtained by considering a well-controlled inspection environment during manufacturing, severe defects detection, and a possible 1°C difference for discrimination. Several aspects of the novel inspection procedure developed can greatly benefit the thermal imaging scientific community.

Funder

Anyang Institute of Technology

Publisher

SAGE Publications

Subject

Mechanical Engineering

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Rapid Sintering and Nondestructive Testing of Nanometal Chip Bonding Layer by Pulsed Current Discharge;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12

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