A new unsymmetrical decomposition of the damage variable

Author:

Voyiadjis George Z1ORCID,Kattan Peter I2

Affiliation:

1. Department of Civil and Environmental Engineering, Louisiana State University, Baton Rouge, LA, USA

2. Independent Researcher, Petra Books, Amman, Jordan

Abstract

This work focuses on the dissection of the damage variable within solid materials. The underlying assumption is that damage within a solid primarily stems from the presence of various defects. The conventional approach to breaking down the damage variable into two parts – one attributed to the first defect type and the other to the second defect type – is both explored and expanded in a coherent mathematical manner. Within this context, a novel and asymmetric dissection of the damage variable is formulated. This fresh asymmetrical approach presents an alternative to the traditional symmetric dissection of the damage variable. Initially, the dissection considerations are carried out in a one-dimensional context using scalar values. However, this methodology is subsequently generalized employing tensors. In the end, an illustrative example is demonstrated.

Publisher

SAGE Publications

Reference53 articles.

1. An Irreversible Thermodynamics Theory for Damage Mechanics of Solids

2. A Thermodynamic Framework for Damage Mechanics of Solder Joints

3. Celentano D J, Tapia P E, Chaboche J-L (2004) Experimental and numerical characterization of damage evolution in steels. In: Buscaglia G, Dari E and Zamonsky O (eds) Mecanica Computacional XXIII, Bariloche, Argentina, pp. 45–58.

4. Continuous damage mechanics — A tool to describe phenomena before crack initiation

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3