Finite element analysis of the three-dimensional crack and defects in piezoelectric materials under the electro-mechanical coupling field

Author:

Zhu Shuai1,Liu Haitao1ORCID

Affiliation:

1. School of Mechanical Engineering, National Engineering Research Center for Technological Innovation Method and Tool, Hebei University of Technology, Tianjin, China

Abstract

This paper presents three-dimensional planar crack and non-planar defects analysis of piezoelectric materials by the finite element method (FEM). Based on practical engineering, a series of reasonable three-dimensional defects models are established. Different from the usual two-dimensional plane as a three-dimensional defect form, the present paper takes into account the different causes, concrete position, and various shapes of typically three-dimensional non-planar defects in practical engineering. By changing the geometric size of the defect and the electro-mechanical boundary conditions, the effects of three-dimensional defect geometry and different electro-mechanical coupling boundary conditions on the distribution of stress, electric field strength, and electric displacement around the defect are investigated. The calculation results show that the electro-mechanical parameters are strongly affected by the geometry of defect and boundary conditions. Furthermore, the distribution of electro-mechanical parameters in the detailed position of the different three-dimensional defect model is also studied, which can accurately assess the location where the defect is prone to fracture. It is concluded that this paper can be used as a reference of three-dimensional defects and the service life of piezoelectric materials in practical engineering structures.

Funder

national natural science foundation of china

Hebei Excellent Youth Science Fund

Science and Technology Project of Heibei Administration for Marker Regulation

Publisher

SAGE Publications

Subject

Mechanical Engineering,General Materials Science

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