Epoxy/polymercaptan microcapsules composite: Synthesis, mechanics, and self-healing behavior

Author:

Deng Xiaocui1ORCID,Li Zhennan1,Yang Jingang1,Li Xing1,Xu Qinming1,Li Gang1,Yuan Qingmei1ORCID

Affiliation:

1. School of Materials and Energy, National Center for International Research on Photoelectric and Energy Materials, Yunnan University, Kunming, China

Abstract

To enhance the longevity of materials, minimize maintenance expenses, and optimize material performance. The wall material employed in this study was urea-melamine-formaldehyde (UMF), and a dual microcapsule self-healing system was established by synthesizing two distinct microcapsules of epoxy resin and polymercaptan via an in situ polymerization technique. Moreover, the reaction conditions were optimized. The reaction parameters were as follows: core-shell ratio of 2:1, surfactant concentration of 0.6 g/L (sodium dodecyl benzene sulfonate (SDBS): Arabic gelatin (GA) = 2:1), polymerization pH = 3.5, stirring rate of 700r/min. Then, the two microcapsules (The mass ratio of the two microcapsules is 1:1) were added to the epoxy resin matrix at 0, 2.5, 5, 7.5, 10, and 12.5 wt% to prepare the resin matrix with self-healing properties. The conical double cantilever beam (TDCB) was used to test the mechanical properties of the matrix. The results showed that the matrix with microcapsule content of 10 wt% had relatively better comprehensive properties, and the self-healing rate was 49.87% at room temperature. These findings provide valuable insights and potential for advancing the development of self-healing materials.

Funder

National Natural Science Foundation of China

Publisher

SAGE Publications

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3