Atomically smooth gallium nitride surface prepared by chemical-mechanical polishing with different abrasives

Author:

Zou Chunli12,Pan Guoshun12,Shi Xiaolei12,Gong Hua12,Zhou Yan12

Affiliation:

1. State Key Laboratory of Tribology, Tsinghua University, Beijing, PR China

2. Shenzhen Key Laboratory of Micro/Nano Manufacturing, Research Institute of Tsinghua University in Shenzhen, Shenzhen, PR China

Abstract

For chemical-mechanical polishing of epitaxial gallium nitride (GaN), a two-step experiment method with two kinds of abrasives, aluminum oxide (Al2O3) and colloidal silica (SiO2), was put forward. The average material removal rates of GaN by the slurry with Al2O3 and SiO2 abrasives were 594.79 and 66.88 nm/h, respectively. An atomically flat surface with roughness (Ra) of 0.056 nm was obtained after the second chemical-mechanical polishing process with SiO2-based slurry, which presented an atomic step-terrace structure. The material removal characteristics of GaN surfaces were investigated in detail. A model was proposed to describe the different behaviors of the two kinds of abrasive during chemical-mechanical polishing process.

Publisher

SAGE Publications

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering

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