Study on the thermal-stress coupling simulation and surface friction of mechanical seal for water pump

Abstract

In view of the problems that the mechanical seal for the water pump is prone to deformation, friction and wear, and loss of sealing performance in the process of use, taking the temperature change of end surface as the research entry point, the temperature distribution, stress and strain diagram of rotating ring, and stationary ring are obtained by thermal-stress coupling simulation. The temperature change of stationary ring is studied by the experiments, and the friction state of end surface of rotating ring and stationary ring are observed. The results indicate that the test temperature of stationary ring is slightly lower than simulation temperature, which is related to the thermocouple fixed on the side of the stationary ring for temperature measurement. In addition, comparing the micro morphology of end surface of rotating ring before and after the experiment, it is found that there is significant plastic deformation on the inner diameter of rotating ring, which is related to the stress generated by the thermal-mechanical coupling of inner diameter of rotating ring exceeding the material limit, consistent with the simulation results.