1. 1) A. Fernández, J. Medina, C. Benkel, M. Guttmann, B. Bilenberg, L. H. Thamdrup, T. Nielsen, C. M. S. Torres and N. Kehagias: Residual Rayer-free Reverse Nanoimprint Lithography on silicon and Metal-coated Substrates, Microelectronic Engineering, 141, (2015) 56.
2. 2) A. Yokoo and H. Namatsu: Nanoelectrode lithography using a flat mold with a pattern defined by different conductivities, Microelectronic Engineering, 87, (2010) 931.
3. 3) C. Steinberg, M. Papenheim, S. Wang and H. C. Scheer: Complex 3D structures via hybrid processing of SU-8, Microelectronic Engineering, 155, (2016) 14.
4. 4) X. Fang, C. Lin, Y. Sun, H. Chin, H. Zan, H. Meng, S. Horng and L. A. Wang: A solvent-free lift-off method for realizing vertical organic transistors with low leakage current and high ON/OFF ratio, Organic Electronics, 31, (2016) 227.
5. 5) T. S. Kulmala, E. Buitrago, M. Vockenhuber and Y. Ekinci: Pattern collapse mitigation in inorganic resists via a polymer freeze technique, Microelectronic Engineering, 155, (2016) 39.